Tessera Partners With University of Alaska Fairbanks to Develop World-Class Microelectronics Center; Chip-Scale Packaging Capability Brings New Educational and Business Opportunities to University of Alaska Fairbanks
SAN JOSE, Calif.—(BUSINESS WIRE)—Aug. 17, 2005—
Tessera Technologies, Inc. (Nasdaq:TSRA), a leading
provider of miniaturization technologies for the electronics industry,
announced today that it has successfully transferred its MicroBGA(R)
chip-scale packaging (CSP) technology to the University of Alaska
Fairbanks (UAF). This licensing and transfer of technology is a part
of the development of an advanced technology center on the UAF campus.
The world-class cleanroom facility is part of UAF's Office of
Electronic Miniaturization (OEM) and is located in UAF's Natural
Sciences Facility (NSF), a modern 123,000 square foot complex of
science laboratories and classrooms that serve the UAF community and
interior Alaska.
Leveraging Tessera's expertise in semiconductor packaging, OEM's
microelectronics center enables UAF to provide packaging and assembly
services for a variety of semiconductor devices, including EEPROM,
DRAM and Flash memory chips. These semiconductor devices are widely
used in defense, medical, wireless, consumer and computing electronics
to meet next-generation miniaturization, performance and reliability
requirements. With the CSP line and a Tessera license in place, UAF is
now capable of serving as a resource for regional enterprise
development and government projects that require reliable,
industry-proven semiconductor packaging capabilities.
"Our work with the University of Alaska Fairbanks illustrates how
collaborations between the country's engineering universities and
leading technology suppliers can offer new capabilities to academic
faculty, students, business and government agencies," said Nicholas
Colella, senior vice president of the Product Miniaturization Division
at Tessera. "We look forward to continuing our relationship with UAF
to help catalyze high technology growth in Alaska."
"UAF's newly installed CSP assembly line together with the Tessera
license has created an exciting opportunity for the university and the
regional economy," said John Dickinson, chief financial officer, OEM,
University of Alaska Fairbanks.
Pramod Karulkar, OEM's director, stated, "UAF can now help grow
new technology companies and can offer students and faculty access to
semiconductor packaging technology that can bring their products from
concept to reality. Moving forward, we plan to continue evolving our
CSP packaging capabilities to include multi-die stacking and other
advanced packaging techniques."
UAF's Office of Electronic Miniaturization cleanroom facility is
the only one of its kind in Alaska. The facility includes a fully
qualified cleanroom that meets and exceeds Federal Standard 209E
requirements. The cleanroom was designed as a Class 10,000 facility,
but is currently operating at the Class 10 Level. The cleanroom
provides a sustainable prototyping and low-volume capacity for
miniaturizing electronic components and component systems for
academic, government and commercial needs.
About Tessera Technologies, Inc.
Tessera Technologies, through its wholly-owned subsidiary Tessera,
Inc., is a leading provider of miniaturization technologies for the
electronics industry. Tessera enables new levels of miniaturization
and performance by applying its unique expertise in the electrical,
thermal and mechanical properties of materials and interconnect. As a
result, Tessera's technologies are widely adopted in high-growth
markets including consumer, computing, communications, medical and
defense. Tessera's customers include the world's top semiconductor
companies such as Intel, Samsung, Renesas, Toshiba and Texas
Instruments. The company's stock is traded on the Nasdaq National
Market under the symbol TSRA. Tessera is headquartered in San Jose,
California. www.tessera.com.
About the University of Alaska Fairbanks' Office of Electronic
Miniaturization
The University of Alaska Fairbanks' Office of Electronic
Miniaturization addresses the ongoing demand for miniaturization of
electronic components and electronic systems by utilizing a core
technology called chip-scale packaging. Basic and advanced chip-scale
packaging prototyping capabilities are housed within cleanroom
facilities, providing a learning laboratory for scientific
investigations and applications which can potentially benefit from
miniaturization. This university facility is the only one of its kind
in Alaska and is expected to be instrumental in creating new
educational opportunities and high-tech jobs for Alaskans in the art
and science of electronic miniaturization, and to provide sustainable
prototyping and low-volume capacity for miniaturizing electronic
components and component systems for government and commercial needs.
www.silicontundra.org.
Safe Harbor Statement
This press release contains forward-looking statements, which are
made pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve
risks and uncertainties that could cause actual results to differ
significantly from those projected. Factors that might cause or
contribute to such differences include, but are not limited to,
fluctuations in Tessera's operating results due to the timing of new
license agreements and royalties, Tessera's ability to protect its
intellectual property and the risk of a decline in demand for
semiconductor products. You are cautioned not to place undue reliance
on the forward-looking statements, which speak only as of the date of
this release. Tessera's filings with the Securities and Exchange
Commission, including its Annual Report on Form 10-K for the year
ended December 31, 2004, and its Quarterly Report on Form 10-Q filed
for the quarter ended June 30, 2005, include more information about
factors that could affect the company's financial results.
Note: Tessera, MicroBGA and the Tessera logo are registered
trademarks of Tessera, Inc. All other company, brand and product names
may be trademarks or registered trademarks of their respective
companies.
Note: The views and conclusions contained herein are those of the
authors and should not be interpreted as necessarily representing the
official policies or endorsements, either expressed or implied, of the
University of Alaska Fairbanks.
Contact:
Tessera
Daryl Larsen, 408-952-4364
Email Contact
or
University of Alaska Fairbanks
Office of Electronic Miniaturization
John Dickinson, 907-455-2002
Email Contact
or
Porter Novelli
Ricky Gradwohl, 408-369-4600 ext. 631
Email Contact
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